Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake) 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 4 Hot-swap 2.5" SAS3 drive bays 6. Broadcom 3008 SAS3 controller; SW RAID 7. 2 SuperDOM onboard or optional 2 M.2 carrier 8. Up to 1000W Redundant Power Supplies Titanium Level (96%)